Mechanical Carbon & Graphite Products
The Carbon Products
Powder Metallurgy Parts
Lapping / Polishing Carrier
Guide Roller for Wire Sawing
Bishenol Epoxy Beam
Carbon Brush for Electrical Machinery
Packaging & ESD Products
Forging Parts
Plastic & Metal Fabrication
 
 
1. The "Lapping Carrier"
To make high quality semiconductor, the wafer cut from silicone ingot needs to have some thickness, the flatness, and to be paralleled. The process of these are called "Lapping Process".

SK-5/POM Insert 30B Lapping Carrier
 
 

Brass
Thickness Range
(i) 0.5mm
(ii) 0.55mm
(iii) 0.7mm
(iv) 0.9mm
(v) Other thickness
 
 
 

G-10
Thickness Range
(i) 0.5mm
(ii) 0.6mm
(iii) 1.0mm
(iv) Other thickness
 
 
 

Polycarbonate (PC)
Thickness Range
(i) 1.5mm
(ii) 2.0mm
(iii) 3.0mm
(iv) 4.0mm
(v) Other thickness
 
 
2. The "Dicing Frame"
To make semiconductor, there are process of cutting water to hundreds of IC chips in milimeter. This process is call "Dicing Process". To settle the wafer, "Dicing Frame" is used. 

Dicing Frame
 
 
3. The "Lapping Carrier" of Polishing Glass - The Liquid Crystal
To make high quality semiconductor, the wafer cut from silicone ingot needs to have some thickness, the flatness, and to be paralleled. The process of these are called "Lapping Process".

SK-5/POM Insert 30B Lapping Carrier

Inner Template Blank for LCD
 
 
4. The "Lapping Carrier" of Polishing MD - The Memory Disk (MD)
MD is usually made of glass and aluminium. MD needs micron precision of surface to memorize a tons of records. The "Lapping Carrier" is used in polishing process.
 
 
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